DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 33

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

Section 14 Flash Memory (0.18-µm F-ZTAT Version)
Table 14.1
Table 14.2
Table 14.3
Table 14.4
Table 14.5
Table 14.6
Table 14.7
Table 14.8
Table 14.9 (1) Useable Area for Programming in User Program Mode ..................................... 420
Table 14.9 (2) Useable Area for Erasure in User Program Mode ............................................... 422
Table 14.9 (3) Useable Area for Programming in User Boot Mode ........................................... 424
Table 14.9 (4) Useable Area for Erasure in User Boot Mode ..................................................... 426
Table 14.10
Table 14.11
Table 14.12
Table 14.13
Table 14.14
Table 14.15
Section 15 Clock Pulse Generator
Table 15.1
Table 15.2
Table 15.3
Table 15.4
Section 16 Power-Down Modes
Table 16.1
Table 16.2
Section 18 Electrical Characteristics
Table 18.1
Table 18.2
Table 18.3
Table 18.4
Table 18.5
Table 18.6
Table 18.7
Table 18.8
Table 18.9
Table 18.10
Table 18.11
Comparison of Programming Modes .................................................................. 376
Pin Configuration ................................................................................................ 381
Register/Parameter and Target Mode .................................................................. 382
Flash Memory Area Divisions............................................................................. 391
Parameters and Target Modes ............................................................................. 392
Setting On-Board Programming Mode................................................................ 401
System Clock Frequency for Automatic-Bit-Rate Adjustment by This LSI ....... 403
Executable MAT ................................................................................................. 419
Hardware Protection............................................................................................ 428
Software Protection ............................................................................................. 429
Inquiry and Selection Commands ....................................................................... 439
Programming/Erasing Command ........................................................................ 450
Status Code.......................................................................................................... 459
Error Code ........................................................................................................... 460
Damping Resistance Value.................................................................................. 464
Crystal Resonator Characteristics........................................................................ 464
External Clock Input Conditions ......................................................................... 465
External Clock Output Stabilization Delay Time ................................................ 466
Operating Modes and Internal States of LSI ....................................................... 470
Operating Frequency and Standby Time ............................................................. 475
Absolute Maximum Ratings................................................................................ 497
DC Characteristics (1) ......................................................................................... 498
DC Characteristics (2) ......................................................................................... 499
Permissible Output Currents................................................................................ 500
Clock Timing....................................................................................................... 501
Control Signal Timing......................................................................................... 503
Bus Timing (1) .................................................................................................... 504
Bus Timing (2) .................................................................................................... 505
DMAC Timing .................................................................................................... 515
Timing of On-Chip Peripheral Modules.............................................................. 518
Flash Memory Characteristics............................................................................. 521
Rev. 2.00, 03/04, page xxxi of xxxii