DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 548

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Rev. 2.00, 03/04, page 514 of 534
φ
φ
Figure 18.18 Self-Refresh Timing (Return from Software Standby Mode: RAST = 0)
φ
,
,
Figure 18.17 CAS-Before-RAS Refresh Timing (with Wait Cycle Insertion)
,
TRp
TRp
Figure 18.16 CAS-Before-RAS Refresh Timing
t
CASD1
TRp
t
CASD1
TRr
TRrw
t
CSD2
t
CSR2
t
t
CSR1
CASD1
TRc
TRr
TRr
t
t
CSD2
CSD2
TRc
TRc1
TRc1
Self-refresh
Tpsr
TRcw
t
CSD2
TRc2
DRAM access
t
CASD1
Tp
t
TRc2
RPS2
t
t
CSD1
CASD1
t
Tr
t
CASD1
CSD1

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