DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 94

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

4.6
Figure 4.2 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
4.7
When accessing word data or longword data, this LSI assumes that the lowest address bit is 0. The
stack should always be accessed in words or longwords, and the value of the stack pointer (SP:
ER7) should always be kept even.
Use the following instructions to save registers:
Use the following instructions to restore registers:
Setting SP to an odd value may lead to a malfunction. Figure 4.3 shows an operation example
when the SP value is odd.
Rev. 2.00, 03/04, page 60 of 534
PUSH.W
PUSH.L
POP.W
POP.L
Stack Status after Exception Handling
Usage Note
Rn
Rn
ERn
ERn
Figure 4.2 Stack Status after Exception Handling
(or
(or
(or
(or
MOV.W Rn, @-SP
MOV.W @SP+, Rn
MOV.L ERn, @-SP
MOV.L @SP+, ERn
SP
(24 bits)
CCR
PC
)
)
)
)