DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 426

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 14.5 Parameters and Target Modes
Note:
Rev. 2.00, 03/04, page 392 of 534
Name of
Parameter
Download pass
and fail result
Flash pass and fail
result
Flash
programming/
erasing frequency
control
Flash multipurpose
address area
Flash multipurpose
data destination
area
Flash erase block
select
*
A single byte of the start address to download an on-chip program, which is specified by
FTDAR
Abbrevia-
tion
DPFR
FPFR
FPEFEQ
FMPAR
FMPDR
FEBS
Down
Load
Initializa-
tion
Program-
ming
Erasure
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial
Value
Undefined
Undefined
Undefined
Undefined
Undefined
Undefined
Alloca-
tion
On-chip
RAM*
R0L of
CPU
R0 of
CPU
On-chip
RAM
On-chip
RAM
R0L of
CPU

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