DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 461

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

Note:
Item
Execution of Erasure
Determination of
Erasure Result
Operation for Erasure
Error
Operation for FKEY
Clear
Switching MATs by
FMATS
*
Switching FMATS by a program in the on-chip RAM enables this area to be used.
On-chip
RAM
Storable/Executable Area
User Boot
MAT
×*
×
×
×
×
External Space
(Expanded
Mode)
×
×
Rev. 2.00, 03/04, page 427 of 534
User
MAT
Selected MAT
User
Boot
MAT
Embedded
Program
Storage Area