DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 275

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
• P51/D1/TEND2
• P50/D0/DREQ2
Note:
EXPE
Bus mode
TENDE
P51DDR
Pin function
EXPE
Bus mode
P50DDR
Pin function
The pin function is switched as shown below according to the combination of the P51DDR bit,
the TENDE bit in DMMDR_2, and the EXPE bit in MDCR.
The pin function is switched as shown below according to the combination of the P50DDR bit,
the DREQS bit in DMMDR_2, and the EXPE bit in MDCR.
*
When DREQS = 1, this pin functions as DREQ2 input.
P51 input
P50 input
0
0
0
0
0
P51 output
P50 output
1
1
P51 input
P50 input
0
All areas are 8-bit space
DREQ2 input*
0
All areas are 8-bit space
0
P51 output
1
P50 output
Rev. 2.00, 03/04, page 241 of 534
1
1
1
TEND2
output
1
At least one area
is 16-bit space
area is 16-bit
At least one
D0 I/O
D1 I/O
space

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