DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 503

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 16 Power-Down Modes
In addition to the normal program execution state, this LSI has power-down modes in which
operation of the CPU and oscillator is halted and power consumption is reduced. Low-power
operation can be achieved by individually controlling the CPU, on-chip peripheral modules, and
so on.
This LSI's operating modes are high-speed mode and four power down modes:
• Sleep mode
• Module stop mode
• Software standby mode
• Hardware standby mode
Sleep mode is a CPU state and module stop mode is an on-chip peripheral function state. A
combination of these modes can be set.
After a reset, this LSI is in high-speed mode.
Table 16.1 shows the internal states of this LSI in each mode. Figure 16.1 shows the mode
transition diagram.
Rev. 2.00, 03/04, page 469 of 534

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