DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 232

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
After one byte or word has been transferred in response to one transfer request, the bus is released.
While the bus is released, one or more CPU bus cycles are initiated.
Figure 7.29 shows an example of transfer when TEND output is enabled, and longword-size,
single address mode transfer (write) is performed from an external device to external 16-bit, 2-
state access space.
Rev. 2.00, 03/04, page 198 of 534
Address bus
φ
Address bus
Bus release
Figure 7.29 Example of Single Address Mode (Longword Write) Transfer
φ
Figure 7.28 Example of Single Address Mode (Word Write) Transfer
release
Bus
DMA write
DMA write
Bus release
release
Bus
DMA write
DMA write
Bus release
release
Bus
Last transfer cycle
Last transfer cycle
DMA write
DMA write
Bus
release
release
Bus

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