DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 512

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
16.3
16.3.1
In software standby mode, I/O port states are retained. Therefore, there is no reduction in current
consumption for the output current when a high-level signal is output.
16.3.2
Current consumption increases during the oscillation stabilization standby period.
16.3.3
Relevant interrupt operations cannot be performed in module stop mode. Consequently, if module
stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU
interrupt source activation source. Interrupts should therefore be disabled before entering module
stop mode.
16.3.4
MSTPCR should only be written to by the CPU.
Rev. 2.00, 03/04, page 478 of 534
Usage Notes
I/O Port Status
Current Consumption during Oscillation Stabilization Standby Period
On-Chip Peripheral Module Interrupts
Writing to MSTPCR

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