MCF5307CFT66B Freescale Semiconductor, MCF5307CFT66B Datasheet - Page 29

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MCF5307CFT66B

Manufacturer Part Number
MCF5307CFT66B
Description
IC MPU 32BIT 66MHZ COLDF 208FQFP
Manufacturer
Freescale Semiconductor
Series
MCF530xr
Datasheets

Specifications of MCF5307CFT66B

Core Processor
Coldfire V3
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, I²C, UART/USART
Peripherals
DMA, POR, WDT
Number Of I /o
16
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
208-FQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

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Quantity
Price
Part Number:
MCF5307CFT66B
Manufacturer:
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Part Number:
MCF5307CFT66B
Manufacturer:
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Quantity:
10 000
Table
Number
17-10
17-11
17-12
17-13
17-14
17-15
17-16
18-1
18-2
18-3
18-4
18-5
18-6
18-7
18-8
18-9
18-10
18-11
18-12
19-1
19-2
19-3
19-4
20-1
20-2
20-3
20-4
20-5
20-6
20-7
20-8
20-9
20-10
20-11
20-12
20-13
20-14
20-15
A-1
A-2
A-3
A-4
A-5
Data Pin Configuration ............................................................................................. 17-12
D7 Selection of CS0 Automatic Acknowledge ........................................................ 17-13
D6 and D5 Selection of CS0 Port Size ..................................................................... 17-13
D4/ADDR_CONFIG, Address Pin Assignment....................................................... 17-13
CLKIN Frequency .................................................................................................... 17-13
BCLKO/PSTCLK Divide Ratios.............................................................................. 17-14
Processor Status Signal Encodings ........................................................................... 17-19
ColdFire Bus Signal Summary ................................................................................... 18-1
Bus Cycle Size Encoding............................................................................................ 18-3
Accesses by Matches in CSCRs and DACRs ............................................................. 18-5
Bus Cycle States ......................................................................................................... 18-6
Allowable Line Access Patterns ............................................................................... 18-12
MCF5307 Arbitration Protocol States ...................................................................... 18-20
ColdFire Bus Arbitration Signal Summary............................................................... 18-21
Cycles for Basic No-Wait-State External Master Access......................................... 18-23
Cycles for External Master Burst Line Access to 32-Bit Port .................................. 18-24
MCF5307 Two-Wire Bus Arbitration Protocol Transition Conditions.................... 18-28
Three-Wire Bus Arbitration Protocol Transition Conditions ................................... 18-32
Data Pin Configuration ............................................................................................. 18-35
JTAG Pin Descriptions ............................................................................................... 19-3
JTAG Instructions....................................................................................................... 19-5
IDCODE Bit Assignments.......................................................................................... 19-6
Boundary-Scan Bit Definitions................................................................................... 19-7
Absolute Maximum Ratings ....................................................................................... 20-1
Operating Temperatures.............................................................................................. 20-1
DC Electrical Specifications ....................................................................................... 20-2
Clock Timing Specification ........................................................................................ 20-2
Input AC Timing Specification................................................................................... 20-3
Output AC Timing Specification ................................................................................ 20-4
Reset Timing Specification....................................................................................... 20-12
Debug AC Timing Specification .............................................................................. 20-12
Timer Module AC Timing Specification.................................................................. 20-14
I
I
UART Module AC Timing Specifications ............................................................... 20-16
General-Purpose I/O Port AC Timing Specifications............................................... 20-18
DMA AC Timing Specifications .............................................................................. 20-19
IEEE 1149.1 (JTAG) AC Timing Specifications ..................................................... 20-20
SIM Registers............................................................................................................... A-1
Interrupt Controller Registers ...................................................................................... A-1
Chip-Select Registers................................................................................................... A-2
DRAM Controller Registers ........................................................................................ A-3
General-Purpose Timer Registers ................................................................................ A-4
2
2
C Input Timing Specifications between SCL and SDA......................................... 20-15
C Output Timing Specifications between SCL and SDA ...................................... 20-15
Freescale Semiconductor, Inc.
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