MCF5307CFT66B Freescale Semiconductor, MCF5307CFT66B Datasheet - Page 99

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MCF5307CFT66B

Manufacturer Part Number
MCF5307CFT66B
Description
IC MPU 32BIT 66MHZ COLDF 208FQFP
Manufacturer
Freescale Semiconductor
Series
MCF530xr
Datasheets

Specifications of MCF5307CFT66B

Core Processor
Coldfire V3
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, I²C, UART/USART
Peripherals
DMA, POR, WDT
Number Of I /o
16
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
208-FQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

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Chapter 4
Local Memory
This chapter describes the MCF5307 implementation of the ColdFire Version 3 local
memory specification. It consists of two major sections.
4.1 Interactions between Local Memory Modules
Depending on configuration information, instruction fetches and data read accesses may be
sent simultaneously to the RAM and cache controllers. This approach is required because
both controllers are memory-mapped devices and the hit/miss determination is made
concurrently with the read data access. Power dissipation can be minimized by configuring
the RAMBARs to mask unused address spaces whenever possible.
If the access address is mapped into the region defined by the RAM (and this region is not
masked), the RAM provides the data back to the processor, and the cache data is discarded.
Accesses from the RAM module are never cached. The complete definition of the
processor’s local bus priority scheme for read references is as follows:
)
For data write references, the memory mapping into the local memories is resolved before
the appropriate destination memory is accessed. Accordingly, only the targeted local
memory is accessed for data write transfers.
4.2 SRAM Overview
The 4-Kbyte on-chip SRAM module is connected to the internal bus and provides pipelined,
single-cycle access to memory mapped to the module. Memory can be mapped to any
• Section 4.2, “SRAM Overview,” describes the MCF5307 on-chip static RAM
• Section 4.7, “Cache Overview,” describes the MCF5307 cache implementation,
(SRAM) implementation. It covers general operations, configuration, and
initialization. It also provides information and examples showing how to minimize
power consumption when using the SRAM.
including organization, configuration, and coherency. It describes cache operations
and how the cache interfaces with other memory structures.
if (RAM “hits”
RAM supplies data to the processor
else if (cache “hits”)
else system memory reference to access data
Freescale Semiconductor, Inc.
For More Information On This Product,
cache supplies data to the processor
Chapter 4. Local Memory
Go to: www.freescale.com
4-1

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