tmp19a61f10xbg TOSHIBA Semiconductor CORPORATION, tmp19a61f10xbg Datasheet - Page 502
tmp19a61f10xbg
Manufacturer Part Number
tmp19a61f10xbg
Description
32-bit Tx System Risc Tx19 Family
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.TMP19A61F10XBG.pdf
(575 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TMP19A61F10XBG
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
- Current page: 502 of 575
- Download datasheet (6Mb)
21.4.2 SAMPLE/PRELOAD Instructions
When using the SAMPLE instruction, complete the instruction update during the system
reset. After the reset is released, do not switch the TAP instruction.
The SAMPLE and PRELOAD instructions are used to connect TDI and TDO by way of the
boundary scan register. This instruction has two functions.
•
•
Input
Input
TDI
TDI
The SAMPLE instruction is used to monitor the I/O pad of an IC. While SAMPLE is
monitoring the I/O pads, the internal logic is not disconnected from the I/O pins of an IC.
This instruction is executed in the Capture-DR state. A main function of SAMPLE is to read
values of the I/O pins of an IC at the rising edge of TCK during normal functional operation.
Fig. 21-9 shows the flow of data while the SAMPLE instruction is selected.
The PRELOAD instruction is used to initialize the boundary scan register before selecting
other instructions. For example, the boundary scan register is initialized using PRELOAD
before selecting the EXTEST instruction, as previously explained. PRELOAD shifts data
into the boundary scan register without affecting the normal operation of the system logic.
Fig. 21.10 shows the flow of data while the PRELOAD instruction is selected.
Fig. 21.10 Flow of Test Data While PRELOAD Is Selected
Fig. 21.9 Flow of Data While SAMPLE Is Selected
TMP19A61 (rev1.0)21 -501
Boundary scan path
Boundary scan path
Internal logic
Internal logic
TMP19A61
Output
Output
TDO
TDO
Related parts for tmp19a61f10xbg
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Toshiba Semiconductor [TOSHIBA IGBT Module Silicon N Channel IGBT]
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
Toshiba Semiconductor [SILICON N CHANNEL 1GBT]
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
Toshiba Semiconductor [GTR Module Silicon N Channel IGBT High Power Switching Applications Motor Control Applications]
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
Toshiba Semiconductor [Power Module]
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA GTR MODULE SILICON NPN TRIPLE DIFFUSED TYPE
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA GTR Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA INTELLIGENT POWER MODULE SILICON N CHANNEL LGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA IGBT Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA GTR MODULE SILICON N−CHANNEL IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA GTR Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA INTELLIGENT POWER MODULE
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet: