DF2110BVTE10 Renesas Electronics America, DF2110BVTE10 Datasheet - Page 280

MCU 3V 64K 100-TQFP

DF2110BVTE10

Manufacturer Part Number
DF2110BVTE10
Description
MCU 3V 64K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2110BVTE10

Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
82
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2110BVTE10
HD64F2110BVTE10

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2110BVTE10V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 12 Serial Communication Interface (SCI)
12.4.3
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK pin can be selected as the SCI’s transfer clock, according to the setting of the C/A bit in
SMR and the CKE1 and CKE0 bits in SCR. When an external clock is input at the SCK pin, the
clock frequency should be 16 times the bit rate used.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin. The
frequency of the clock output in this case is equal to the bit rate, and the phase is such that the
rising edge of the clock is in the middle of the transmit data, as shown in figure 12.4.
Rev. 2.00 Mar 21, 2006 page 240 of 518
REJ09B0299-0200
SCK
TxD
Clock
Figure 12.4 Relation between Output Clock and Transmit Data Phase
0
D0
D1
D2
(Asynchronous Mode)
D3
D4
1 frame
D5
D6
D7
0/1
1
1

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