UPD78F1000GB-GAF-AX Renesas Electronics America, UPD78F1000GB-GAF-AX Datasheet - Page 1142

• Manufacturer Part Number: UPD78F1000GB-GAF-AX
• Description: MCU 16BIT 78K0R/KX3-L 44-LQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0R/Kx3-Lr

Specifications of UPD78F1000GB-GAF-AX

• Core Processor: 78K/0R
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

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78K0R/Kx3-L
Notes 1. The
Caution Do not use different soldering methods together (except for partial heating).
R01UH0106EJ0300 Rev.3.00
Oct 01, 2010
Infrared reflow
Partial heating
Infrared reflow
Soldering Method
Soldering Method
• 48-pin plastic TQFP (fine pitch) (7 × 7)
• 64-pin plastic LQFP (fine pitch) (10 × 10)
• 64-pin plastic TQFP (fine pitch) (7 × 7)
•80-pin plastic LQFP (fine pitch) (12 × 12)
•100-pin plastic LQFP (fine pitch) (14 × 14)
• 64-pin plastic FBGA (5 × 5)
• 64-pin plastic FBGA (4 × 4)
• 100-pin plastic FBGA (6 × 6)
μ
μ
μ
μ
μ
μ
μ
μ
μ
PD78F1001GA-HAA-AX,
PD78F1007GB-GAH-AX,
PD78F1007GA-HAB-AX,
PD78F1010GK-GAK-AX,
PD78F1027GK-GAK-AX,
PD78F1013GC-UEU-AX,
PD78F1007F1-AN1-A,
PD78F1007F1-AA2-A,
PD78F1013F1-BAK-A,
2. After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
μ
PD78F1029 and
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Table 33-1. Surface Mounting Type Soldering Conditions (2/2)
μ
μ
μ
PD78F1008F1-AA2-A,
PD78F1008F1-AN1-A,
PD78F1041F1-BAK-A
μ
μ
μ
μ
μ
μ
μ
PD78F1002GA-HAA-AX,
PD78F1008GA-HAB-AX,
PD78F1011GK-GAK-AX,
PD78F1028GK-GAK-AX
PD78F1008GB-GAH-AX,
PD78F1014GC-UEU-AX,
Note 1
PD78F1030 don’t have the FBGA package.
Soldering Conditions
Soldering Conditions
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
μ
μ
PD78F1009F1-AA2-A
PD78F1009F1-AN1-A
μ
μ
μ
μ
μ
Note
Note 2
PD78F1003GA-HAA-AX
PD78F1009GA-HAB-AX
PD78F1012GK-GAK-AX,
PD78F1009GB-GAH-AX
PD78F1029GC-UEU-AX,
(after that, prebake at 125°C for
(after that, prebake at 125°C for
μ
PD78F1030GC-UEU-AX
IR60-107-3
IR60-107-3
Condition Symbol
Condition Symbol
Recommended
Recommended
−
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