UPD78F1000GB-GAF-AX Renesas Electronics America, UPD78F1000GB-GAF-AX Datasheet - Page 362

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UPD78F1000GB-GAF-AX

Manufacturer Part Number
UPD78F1000GB-GAF-AX
Description
MCU 16BIT 78K0R/KX3-L 44-LQFP
Manufacturer
Renesas Electronics America
Series
78K0R/Kx3-Lr
Datasheet

Specifications of UPD78F1000GB-GAF-AX

Core Processor
78K/0R
Core Size
16-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD78F1000GB-GAF-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
78K0R/Kx3-L
R01UH0106EJ0300 Rev.3.00
Oct 01, 2010
Caution 1. When using the X1 oscillator and XT1 oscillator, wire as follows in the area enclosed by the
broken lines in the Figures 7-13 and 7-14 to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines. Do not route the wiring near a signal line
• Always make the ground point of the oscillator capacitor the same potential as V
• Do not fetch signals from the oscillator.
The XT1 oscillator is a circuit with low amplification in order to achieve low-power consumption.
Note the following points when designing the circuit.
• Pins and circuit boards include parasitic capacitance. Therefore, perform oscillation evaluation
• When using the ultra-low power consumption oscillation (AMPHS1 = 1) as the mode of the XT1
• Make the wiring between the XT1 and XT2 pins and the resonators as short as possible, and
• Configure the circuit of the circuit board, using material with little wiring resistance.
• Place a ground pattern that has the same potential as V
• Be sure that the signal lines between the XT1 and XT2 pins, and the resonators do not cross
• The impedance between the XT1 and XT2 pins may drop and oscillation may be disturbed due
• When coating the circuit board, use material that does not cause capacitance or leakage
through which a high fluctuating current flows.
ground the capacitor to a ground pattern through which a high current flows.
using a circuit board to be actually used and confirm that there are no problems.
oscillator, use the recommended resonators described in CHAPTER 30 ELECTRICAL
SPECIFICATIONS (78K0R/KC3-L, 78K0R/KD3-L, 78K0R/KE3-L) or CHAPTER 31 ELECTRICAL
SPECIFICATIONS (78K0R/KF3-L, 78K0R/KG3-L).
minimize the parasitic capacitance and wiring resistance. Note this particularly when the ultra-
low power consumption oscillation (AMPHS1 = 1) is selected.
oscillator.
with the other signal lines. Do not route the wiring near a signal line through which a high
fluctuating current flows.
to moisture absorption of the circuit board in a high-humidity environment or dew
condensation on the board.
measures to damp-proof the circuit board, such as by coating.
between the XT1 and XT2 pins.
When using the circuit board in such an environment, take
CHAPTER 7 CLOCK GENERATOR
SS
as much as possible near the XT1
SS
. Do not
362

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