UPD78F1000GB-GAF-AX Renesas Electronics America, UPD78F1000GB-GAF-AX Datasheet - Page 43

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UPD78F1000GB-GAF-AX

Manufacturer Part Number
UPD78F1000GB-GAF-AX
Description
MCU 16BIT 78K0R/KX3-L 44-LQFP
Manufacturer
Renesas Electronics America
Series
78K0R/Kx3-Lr
Datasheet

Specifications of UPD78F1000GB-GAF-AX

Core Processor
78K/0R
Core Size
16-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD78F1000GB-GAF-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
78K0R/Kx3-L
1.7 Outline of Functions
1. 7. 1 78K0R/KC3-L, 78K0R/KD3-L, 78K0R/KE3-L
R01UH0106EJ0300 Rev.3.00
Oct 01, 2010
Internal
memory
Memory space
Main system
clock
Subsystem clock
Internal low-speed oscillation clock
(dedicated to WDT)
General-purpose register
Minimum instruction execution time
Instruction set
I/O port
Timer
Notes 1.
2.
Flash memory
(KB)
RAM (KB)
High-speed system
clock
Internal high-speed
oscillation clock
20 MHz internal high-
speed oscillation
clock
Total
CMOS I/O
CMOS input
CMOS output
N-ch open-drain I/O
(6 V tolerance)
16-bit timer
Watchdog timer
Real-time counter (RTC)
Timer output
RTC output
Item
This is 2 KB when the self-programming function is used.
The number of outputs varies, depending on the setting.
6
1 MB
X1 (crystal/ceramic) oscillation, external main system clock input (EXCLK)
2 to 20 MHz: V
Internal oscillation
1 MHz (TYP.), 8 MHz (TYP.): V
Internal oscillation
20 MHz (TYP.): V
Internal oscillation
30 kHz (TYP.): V
8 bits × 32 registers (8 bits × 8 registers × 4 banks)
0.05
• 8-bit operation, 16-bit operation
• Multiplication (8 bits × 8 bits)
• Bit manipulation (Set, reset, test, and Boolean operation), etc.
(PWM outputs: 6
16
1
μ
s (High-speed system clock: f
1.5
32
40-pin
33
31
2
48
2
DD
Note 2
DD
= 2.7 to 5.5 V, 2 to 5 MHz: V
DD
Note 1
3/2
64
= 1.8 to 5.5 V
)
= 2.7 to 5.5 V
XT1 (crystal) oscillation
32.768 kHz (TYP.): V
61
8
(PWM outputs: 7
2
• 1 Hz (subsystem clock: f
• 512 Hz, 16.384 kHz, or 32.768 kHz (subsystem clock: f
78K0R/KC3-L
16
1
μ
s (Subsystem clock: f
1.5
32
44-pin
DD
37
33
4
= 1.8 to 5.5 V
MX
48
2
= 20 MHz operation)
Note 2
Note 1
3/2
64
8 channels
)
1 channel
DD
DD
= 1.8 to 5.5 V
1.5
32
= 1.8 to 5.5 V
SUB
SUB
48-pin
= 32.768 kHz operation)
= 32.768 kHz)
48
41
34
2
4
1
2
1 channel
Note 1
3/2
64
1.5
78K0R/KD3-L
32
CHAPTER 1 OUTLINE
48
45
38
2
4
1
2
Note 1
3/2
64
SUB
1.5
78K0R/KE3-L
32
= 32.768 kHz)
48
55
48
2
4
1
2
(1/2)
Note 1
3/2
64
43

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