HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 529

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Figures 13.8 shows example of DMA transfer timing in single address mode.
Two kinds of transfer are possible in single address mode: (1) transfer between an external
device with DACK and a memory-mapped external device, and (2) transfer between an
external device with DACK and external memory. In both cases, only the external request
signal (DREQ) is used for transfer requests.
This LSI
Figure 13.7 Data Flow in Single Address Mode
Data flow
DMAC
External address bus
DACK
DREQ
Section 13 Direct Memory Access Controller (DMAC)
External data bus
Rev. 1.00 Dec. 27, 2005 Page 485 of 932
External device
with DACK
External
memory
REJ09B0269-0100

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