HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 918

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 24 Electrical Characteristics
24.3.5
Rev. 1.00 Dec. 27, 2005 Page 874 of 932
REJ09B0269-0100
D31 to D0
A25 to A0
DACKn*
RD/WR
CKIO
WAIT
WEn
CSn
RD
BS
Figure 24.21 Burst ROM Read Cycle (One Access Wait, One External Wait,
2
Burst ROM Timing
Notes: 1. t
2. DACKn is a waveform when active-low is specified.
t
RDH3
WED
is specified by earlier one of change of A25 to A0 or the RD rising edge.
t
t
t
t
CSD1
AD1
RWD1
DACD
t
BSD
t
RSD
T1
One Burst Wait, Two Bursts)
t
BSD
t
WTH
t
Tw
WTS
t
WTH
Twx
t
WTS
t
T2B
AD2
t
RDS3
t
RDH3
*
1
Twb
t
t
T2B
RSD
t
AD2
RDS3
t
RDH3
t
t
t
CSD1
RWD1
DACD
*
t
1
WED

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