DS3181 Maxim Integrated Products, DS3181 Datasheet - Page 2

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DS3181

Manufacturer Part Number
DS3181
Description
Network Controller & Processor ICs DS3-E3 ATM-Packet PH Y with Built-in Line
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of DS3181

Product
Framer
Number Of Transceivers
1
Data Rate
44.736 Mbps
Supply Voltage (max)
3.465 V
Supply Voltage (min)
3.135 V
Supply Current (max)
280 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Package / Case
TEBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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FEATURES (continued)
DETAILED DESCRIPTION
The DS3181 (single), DS3182 (dual), DS3183 (triple), and DS3184 (quad) PHYs perform all the functions
necessary for mapping/demapping ATM cells and/or packets into as many as four DS3 (44.736Mbps) framed, E3
(34.368Mbps) framed, or 52Mbps clear-channel data streams on DS3, E3, or STS-1 physical copper lines. Each
line interface unit (LIU) has independent receive and transmit paths. The receiver LIU block performs clock and
data recovery from a B3ZS- or HDB3-coded AMI signal and monitors for loss of the incoming signal or can be
bypassed for direct clock and data inputs. The receiver LIU block optionally performs B3ZS/HDB3 decoding. The
transmitter LIU drives standard pulse-shape waveforms onto 75Ω coaxial cable or can be bypassed for direct clock
and data outputs. The jitter attenuator can be placed in either transmit or receive data path when the LIU is
enabled. Dedicated cell processor and packet processor blocks prepare outgoing cells or packets for transmission
and check incoming cells or packets upon arrival. Built-in DS3/E3 framers transmit and receive cell/packet data in
properly formatted M23 DS3, C-bit DS3, G.751 E3, or G.832 E3 data streams. PLCP framers provide legacy ATM
transmission-convergence
integrated hardware support for both cells and packets, the DS318x DS3/E3 ATM/Packet PHYs provide system on-
chip solutions (from DS3/E3/STS-1 physical copper lines to ATM/Packet UTOPIA/POS-PHY Level 2/3 system
switch) for universal high-density line cards in the unchannelized DS3/E3/clear-channel DS3 ATM/Packet
applications. Unused functions can be powered down to reduce device power. The DS318x ATM/Packet PHYs with
embedded LIU conform to the telecommunications standards listed in Section
Direct and Clear-Channel Packet Mapping
On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or
G.832) Framer(s)
Ports Independently Configurable for DS3, E3
(Full or Subrate) or Arbitrary Framing Protocols
Up to 52Mbps
Programmable (Externally Controlled or
Internally Finite State Machine Controlled)
Subrate DS3/E3
Full-Featured DS3/E3/PLCP Alarm Generation
and Detection
Built-In HDLC Controllers with 256-Byte FIFOs
for Insertion/Extraction of DS3 PMDL, G.751 Sn
Bit, and G.832 NR/GC Bytes and PLCP NR/GC
Bytes
On-Chip BERTs for PRBS and Repetitive Pattern
Generation, Detection, and Analysis
Large Performance-Monitoring Counters for
Accumulation Intervals of at Least 1 Second
Flexible Overhead Insertion/Extraction Ports for
DS3, E3, and PLCP Framers
support.
DSS scrambling is performed for clear-channel ATM cell
2
Loopbacks Include Line, Diagnostic, Framer,
Payload, Analog, and System Interface with
Capabilities to Insert AIS in the Directions Away
from Loopback Directions
Ports can be Disabled to Reduce Power
Integrated Clock Rate Adapter to Generate the
Remaining Internally Required 44.736MHz
(DS3), 34.368MHz (E3), and 52MHz (Arbitrary
Framing at Up to 52Mbps) from a Single Clock
Reference Source at One of Those Three
Frequencies
Pin Compatible with the DS3171/2/3/4 Family
and the DS3161/2/3/4 Family
8/16-Bit Generic Microprocessor Interface
Low-Power (2.7W typ) 3.3V Operation (5V-
Tolerant I/O)
Small, High-Density, Thermally Enhanced, BGA
Packaging (TE-PBGA) with 1.27mm Pin Pitch
Industrial Temperature Operation:
-40°C to +85°C
IEEE1149.1 JTAG Test Port
4.
support.
With

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