HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 125

IC H8S MCU FLASH 256K 100-QFP

HD64F2318VTE25

Manufacturer Part Number
HD64F2318VTE25
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2318VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM or reserved area when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit to 0 in
4. Do not access the reserved areas.
SYSCR.
Figure 3.4 (c) H8S/2317 Memory Map in Each Operating Mode
H'000000
H'010000
H'020000
H'040000
H'FFDC00
H'FFFC00
H'FFFE50
H'FFFF08
H'FFFF28
H'FFFFFF
(advanced expanded mode
with on-chip ROM enabled)
Mode 14 Boot Mode
Reserved area
External address
external address
external address
External address
External address
On-chip RAM
On-chip ROM/
On-chip ROM
I/O registers
I/O registers
space
space
Internal
Internal
space
space
space
(F-ZTAT Version Only)
*1
*1
*3
*4
/
H'000000
H'010000
H'020000
H'03FFFF
H'FFDC00
H'FFFBFF
H'FFFE50
H'FFFF07
H'FFFF28
H'FFFFFF
(advanced single-chip
Mode 15 Boot Mode
Rev.7.00 Feb. 14, 2007 page 91 of 1108
On-chip RAM
On-chip ROM/
On-chip ROM
I/O registers
I/O registers
mode)
Reserved
reserved
area
Internal
Internal
area
Section 3 MCU Operating Modes
*2 *4
*4
*3
REJ09B0089-0700

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