HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 684

• Manufacturer Part Number: HD64F2318VTE25
• Description: IC H8S MCU FLASH 256K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2318VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 17 ROM
17.15.1 Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the
host beforehand. The channel 1 SCI to be used is set to asynchronous mode.
When a reset-start is executed after the H8S/2319 F-ZTAT chip’s pins have been set to boot mode,
the boot program built into the chip is started and the programming control program prepared in
the host is serially transmitted to the chip via the SCI. In the chip, the programming control
program received via the SCI is written into the programming control program area in on-chip
RAM. After the transfer is completed, control branches to the start address of the programming
control program area and the programming control program execution state is entered (flash
memory programming is performed).
The transferred programming control program must therefore include coding that follows the
programming algorithm given later.
The system configuration in boot mode is shown in figure 17.40, and the boot program mode
execution procedure in figure 17.41.
Rev.7.00 Feb. 14, 2007 page 650 of 1108
REJ09B0089-0700
Host
Figure 17.40 System Configuration in Boot Mode
Verify data transmission
Write data reception
Chip
RxD1
TxD1
SCI1
Flash memory
On-chip RAM