HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 982

Manufacturer Part Number

HD64F2318VTE25

IC H8S MCU FLASH 256K 100-QFP

Manufacturer

Renesas Electronics America

H8® H8S/2300r

Core Processor

Connectivity

SCI, SmartCard

POR, PWM, WDT

Number Of I /o

Program Memory Size

256KB (256K x 8)

Program Memory Type

Voltage - Supply (vcc/vdd)

2.7 V ~ 3.6 V

Data Converters

A/D 8x10b; D/A 2x8b

Oscillator Type

Operating Temperature

-20°C ~ 75°C

Package / Case

100-TQFP, 100-VQFP

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Appendix B Internal I/O Registers

Rev.7.00 Feb. 14, 2007 page 948 of 1108

REJ09B0089-0700

10. Valid in the H8S/2318 F-ZTAT only.

11. Valid in the H8S/2315 F-ZTAT, H8S/2314 F-ZTAT only.

12. Valid in the H8S/2319 F-ZTAT only.

13. Valid in the H8S/2319C F-ZTAT only.

Located in on-chip RAM. The bus width is 32 bits when the DTC accesses this area as

Valid only in the F-ZTAT versions but the H8S/2314 F-ZTAT. In the H8S/2314 F-ZTAT,

this cannot be used and must not be accessed.

Valid only in the F-ZTAT versions.

Functions as C/A for SCI use, and as GM for smart card interface use.

Functions as CHR for SCI use, and as BLK for smart card interface use.

Functions as STOP for SCI use, and as BCP1 for smart card interface use.

Functions as MP for SCI use, and as BCP0 for smart card interface use.

Functions as FER for SCI use, and as ERS for smart card interface use.

Valid in the H8S/2317 F-ZTAT only.