HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 665

IC H8S MCU FLASH 256K 100-QFP

HD64F2318VTE25

Manufacturer Part Number
HD64F2318VTE25
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2318VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
17.13.3 Flash Memory Operating Modes
Mode Transitions: When the mode pins are set in the reset state and a reset-start is executed, the
chip enters one of the operating modes shown in figure 17.34. In user mode, flash memory can be
read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and PROM
mode.
Notes: Only make a transition between user mode and user program mode when the CPU is
SWE = 1
(on-chip ROM
User mode
enabled)
not accessing the flash memory.
* MD2 = MD1 = MD0 = 0, PF2 = 1, PF1 = 0, PF0 = 0
On-board programming mode
program mode
SWE = 0
User
Figure 17.34 Flash Memory Mode Transitions
MD1 = 1,
MD2 = 1
RES = 0
RES = 0
MD1 = 1,
MD2 = 0
Reset state
Boot mode
Rev.7.00 Feb. 14, 2007 page 631 of 1108
RES = 0
*
RES = 0
Programmer mode
REJ09B0089-0700
Section 17 ROM

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