HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 593

IC H8S MCU FLASH 256K 100-QFP

HD64F2318VTE25

Manufacturer Part Number
HD64F2318VTE25
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2318VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
15.3
The D/A converter includes D/A conversion circuits for two channels, each of which can operate
independently.
D/A conversion is performed continuously while enabled by DACR. If either DADR0 or DADR1
is written to, the new data is immediately converted. The conversion result is output by setting the
corresponding DAOE0 or DAOE1 bit to 1.
The operation example described in this section concerns D/A conversion on channel 0. Figure
15.2 shows the timing of this operation.
[1] Write the conversion data to DADR0.
[2] Set the DAOE0 bit in DACR01 to 1. D/A conversion is started and the DA0 pin becomes an
[3] If DADR0 is written to again, the new data is immediately converted. The new conversion
[4] If the DAOE0 bit is cleared to 0, the DA0 pin becomes an input pin.
output pin. The conversion result is output after the conversion time has elapsed. The output
value is expressed by the following formula:
The conversion results are output continuously until DADR0 is written to again or the DAOE0
bit is cleared to 0.
result is output after the conversion time has elapsed.
DADR contents
Operation
256
×
V
ref
Rev.7.00 Feb. 14, 2007 page 559 of 1108
Section 15 D/A Converter
REJ09B0089-0700

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