HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 30

• Manufacturer Part Number: HD64F2318VTE25
• Description: IC H8S MCU FLASH 256K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2318VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

17.17 Flash Memory Protection.................................................................................................. 662
17.18 Flash Memory Emulation in RAM ................................................................................... 666
17.19 Interrupt Handling when Programming/Erasing Flash Memory....................................... 668
17.20 Flash Memory Programmer Mode .................................................................................... 669
17.21 Flash Memory Programming and Erasing Precautions ..................................................... 684
17.22 Overview of Flash Memory (H8S/2319C 0.18µm F-ZTAT)............................................ 686
17.23 Register Description of Flash Memory ............................................................................. 697
17.24 On-Board Programming Mode ......................................................................................... 720
17.25 Protection .......................................................................................................................... 738
Rev.7.00 Feb. 14, 2007 page xxviii of xxxii
REJ09B0089-0700
17.17.1 Hardware Protection ............................................................................................ 662
17.17.2 Software Protection.............................................................................................. 663
17.17.3 Error Protection.................................................................................................... 664
17.18.1 Emulation in RAM............................................................................................... 666
17.18.2 RAM Overlap ...................................................................................................... 667
17.20.1 Programmer Mode Setting ................................................................................... 669
17.20.2 Socket Adapters and Memory Map...................................................................... 670
17.20.3 Programmer Mode Operation .............................................................................. 672
17.20.4 Memory Read Mode ............................................................................................ 673
17.20.5 Auto-Program Mode ............................................................................................ 677
17.20.6 Auto-Erase Mode ................................................................................................. 679
17.20.7 Status Read Mode ................................................................................................ 680
17.20.8 Status Polling ....................................................................................................... 681
17.20.9 Programmer Mode Transition Time..................................................................... 682
17.20.10 Notes on Memory Programming........................................................................ 682
17.22.1 Features................................................................................................................ 686
17.22.2 Overview.............................................................................................................. 688
17.22.3 Operating Mode of Flash Memory....................................................................... 689
17.22.4 Mode Comparison................................................................................................ 690
17.22.5 Flash MAT Configuration.................................................................................... 691
17.22.6 Block Division ..................................................................................................... 692
17.22.7 Programming/Erasing Interface ........................................................................... 693
17.22.8 Pin Configuration................................................................................................. 695
17.22.9 Register Configuration......................................................................................... 695
17.23.1 Programming/Erasing Interface Register ............................................................. 697
17.23.2 Programming/Erasing Interface Parameter .......................................................... 704
17.23.3 System Control Register 2 (SYSCR2) ................................................................. 717
17.23.4 RAM Emulation Register (RAMER)................................................................... 718
17.24.1 Boot Mode ........................................................................................................... 720
17.24.2 User Program Mode............................................................................................. 724
17.24.3 User Boot Mode................................................................................................... 734