HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 819

IC H8S MCU FLASH 256K 100-QFP

HD64F2318VTE25

Manufacturer Part Number
HD64F2318VTE25
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2318VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Table 17.69 AC Characteristics Auto-Erase Mode
Condition: V
Code
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Programming pulse width
Status polling start time
Status polling access time
Memory erase time
WE rise time
WE fall time
I/O5-0
A18-0
I/O7
I/O6
WE
OE
CE
CC
= 3.3 V ± 0.3 V, V
t
ces
tf
t
t
ds
wep
Figure 17.93 Timing in Auto-Erase Mode
H'20 or
H'25
t
tr
ceh
t
dh
SS
t
nxtc
= 0 V, T
Symbol
t
t
t
t
t
t
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
ests
spa
erase
r
f
a
H'20 or
H'25
= 25˚C ± 5˚C
Erase normal
and confirmation
signal
Erase end
identification
signal
t
ests
Min
20
0
0
50
50
70
1
100
Rev.7.00 Feb. 14, 2007 page 785 of 1108
t
erase
t
spa
H'00
Max
150
40000
30
30
t
nxtc
REJ09B0089-0700
Section 17 ROM
Unit
μs
ns
ns
ns
ns
ns
ms
ns
ms
ns
ns

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