HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 131

• Manufacturer Part Number: HD64F2318VTE25
• Description: IC H8S MCU FLASH 256K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2318VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Figure 3.7 (b) H8S/2314 Memory Map in Each Operating Mode (F-ZTAT Version Only)
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit to 0 in
4. Do not access the reserved area in addresses H'060000 to H'07FFFF.
5. Do not access the reserved areas.
SYSCR.
H'000000
H'010000
H'060000
H'080000
H'FFDC00
H'FFEC00
H'FFFC00
H'FFFE50
H'FFFF08
H'FFFF28
H'FFFFFF
(advanced expanded mode
with on-chip ROM enabled)
Mode 10 Boot Mode
External address
External address
External address
external address
Reserved area
Reserved area
On-chip RAM
On-chip ROM/
On-chip ROM
I/O registers
I/O registers
space
Internal
Internal
space
space
space
*1
*3
*4
*5
H'000000
H'010000
H'060000
H'07FFFF
H'FFDC00
H'FFEC00
H'FFFBFF
H'FFFE50
H'FFFF07
H'FFFF28
H'FFFFFF
Rev.7.00 Feb. 14, 2007 page 97 of 1108
(advanced single-chip
Mode 11 Boot Mode
Section 3 MCU Operating Modes
Reserved area
Reserved area
On-chip RAM
On-chip ROM/
On-chip ROM
I/O registers
I/O registers
mode)
reserved
area
Internal
Internal
*2 *5
*3
*5
*4
REJ09B0089-0700