HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 725

• Manufacturer Part Number: HD64F2318VTE25
• Description: IC H8S MCU FLASH 256K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2318VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

17.22.5 Flash MAT Configuration
This LSI's flash memory is configured by the 512-kbyte user MAT and 8-kbyte user boot MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS.
The user MAT or user boot MAT can be read in all modes if it is in ROM valid mode. However,
the user boot MAT can be programmed only in boot mode and PROM mode.
The user MAT and user boot MAT have different memory sizes. Do not access a user boot MAT
that is 8 kbytes or more. When a user boot MAT exceeding 8 kbytes is read from, an undefined
value is read.
Address H'000000
Address H'07FFFF
Figure 17.62 Flash Memory Configuration
<User MAT>
512 kbytes
Address H'001FFF
Address H'000000
Rev.7.00 Feb. 14, 2007 page 691 of 1108
<User boot MAT>
REJ09B0089-0700
Section 17 ROM
8 kbytes