HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 213

IC H8S MCU FLASH 256K 100-QFP

HD64F2318VTE25

Manufacturer Part Number
HD64F2318VTE25
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2318VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
6.7.4
Figure 6.19 shows the timing for transition to the bus released state.
Address bus
HWR, LWR
BREQO *
Data bus
[1]
[2]
[3]
[4]
[5]
[6]
Note: * Output only when BREQOE is set to 1.
BREQ
BACK
Low level of BREQ pin is sampled at rise of T
BACK pin is driven low at end of CPU read cycle, releasing bus to external
bus master.
BREQ pin state is still sampled in external bus released state.
High level of BREQ pin is sampled.
BACK pin is driven high, ending bus release cycle.
BREQO signal goes high 1.5 clocks after BACK signal goes high.
RD
AS
Transition Timing
φ
T
0
Figure 6.19 Bus Released State Transition Timing
CPU cycle
T
Address
1
[1]
Minimum
1 state
T
2
[2]
2
state.
External bus released state
[3]
Rev.7.00 Feb. 14, 2007 page 179 of 1108
High impedance
High impedance
High impedance
High impedance
High impedance
[4]
Section 6 Bus Controller
[5]
REJ09B0089-0700
cycle
CPU
[6]

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