HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 808

• Manufacturer Part Number: HD64F2318VTE25
• Description: IC H8S MCU FLASH 256K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2318VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 17 ROM
Erasure
Erasure is performed with the erasure selection and block erasure command.
Firstly, erasure is selected by the erasure selection command and the boot program then erases the
specified block. The command should be repeatedly executed if two or more blocks are to be
erased. Sending a block-erasure command from the host with the block number H'FF will stop the
erasure operating. On completion of erasing, the boot program will wait for selection of
programming or erasing.
The sequences of the issuing of erasure selection commands and the erasure of data are shown in
figure 17.87.
(1) Erasure Selection
The boot program will transfer the erasure program. User MAT data is erased by the transferred
erasure program.
Command
• Command, H'48, (1 byte): Erasure selection
Response
• Response, H'06, (1 byte): Response for erasure selection
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REJ09B0089-0700
After the erasure program has been transferred, the boot program will return ACK.
Repeat
H'48
H'06
Host
Figure 17.87 Erasure Sequence
Preparation for Erasure (H'48)
Erasure (Erased Block Number)
Erasure (H'FF)
ACK
ACK
ACK
Transfer of Erasure
Boot Program
Erasure
Program