BMSKTOPASA900(DCE) Toshiba, BMSKTOPASA900(DCE) Datasheet - Page 925
BMSKTOPASA900(DCE)
Manufacturer Part Number
BMSKTOPASA900(DCE)
Description
KIT STARTER TMPA900 USB JTAG
Manufacturer
Toshiba
Series
TOPASr
Type
MCUr
Specifications of BMSKTOPASA900(DCE)
Contents
Evaluation Board, Cable(s), Software and Documentation
For Use With/related Products
TMPA900CMXBG
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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4.
4.1
Electrical Characteristics
parameter
Solderability
Absolute Maximum Ratings
Test
Note 1: Do not exceed the absolute maximum rating of DVCC3IO (SM2-4, SM6,SM7, SN0-2, SP0-5, PA0-3, PB0-3,
Note 2:Do not exceed the absolute maximum rating of DVCCM (SA0-7, SB0-7, SC0-7, SD0-7, SE0-7, SF0-7, SG0-7,
Note 3: Do not exceed the absolute maximum rating of DVCC3LCD (ST0-7, SU0,SU1,SU3,SU4, PJ0-7, PK0-7)
Note 4: For PD0-7, VREFH, VREFL the absolute maximum rating of AVCC3AD is applied.
Note 5: For the USB, DDM and DDP- pins, the absolute maximum rating of AVCC3T/3C is applied.
Note 6: The absolute maximum ratings are rated values that must not be exceeded during operation, even for an
DVCC3LCD
AVCC3AD
DVCC3IO
Symbol
DVCC1C
DVCC1A
DVCC1B
AVDD3T
AVDD3C
AVCC3H
T
DVCCM
SOLDER
Σ
T
Σ
T
PC2-4, PC6~PC7, PF6,PF7, PG0-PG7, PL0~PL4, PM0~PM3, PN0-PN7, PT0-PT7, PU0~PU7, PV0~PV7)
SH2,SH3,SH4,SH7, SJ0-7, SK0-7, SL0-2, SL4~SL6, PR0-2)
instant. Any one of the ratings must not be exceeded. If any absolute maximum rating is exceeded, the device
may break down or its performance may be degraded, causing it to catch fire or explode resulting in injury to
the user. Thus, when desigining products that include this device, ensure that no absolute maximum rating
value will ever be exceeded.
Solderability
I
V
I
P
STG
OPR
OH
OL
IOH
IOL
IN
D
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Power supply voltage
Input voltage
Output current (per pin)
Output current (per pin)
Output current (total)
Output current (total)
Power consumption (Ta = 85ºC)
Soldering temperature (10s)
Storage temperature
Operating temperature
Parameter
Test condition
TMPA900CM- 924
TENTATIVE
-0.3 to DVCC3LCD+0.3 (Note 3)
-0.3 to AVCC3AD+0.3 (Note 4)
-0.3 to DVCC3IO+0.3 (Note 1)
-0.3 to AVDD3C+0.3 (Note 5)
-0.3 to AVDD3T+0.3 (Note 5)
-0.3 to DVCCM+0.3 (Note 2)
-0.3 to AVCC3H+0.3
-0.3 to 3.8
-0.3 to 2.0
-0.3 to 3.8
-65 to 150
-20 to 85
Rating
800
260
-80
80
-5
5
Pass:
solderability rate until forming ≥ 95%
Unit
mW
mA
mA
mA
mA
Note
°C
°C
°C
V
V
TMPA900CM
2009-10-14
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