DF61654N50FTV Renesas Electronics America, DF61654N50FTV Datasheet - Page 28

• Manufacturer Part Number: DF61654N50FTV
• Description: IC H8SX/1654 MCU FLASH 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of DF61654N50FTV

• Core Processor: H8SX
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 75
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK1657 - DEV EVAL KIT FOR H8SX/1657
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

22.9 Bφ Clock Output Control................................................................................................... 874
22.10 Usage Notes ....................................................................................................................... 875
Section 23 List of Registers............................................................................... 877
23.1 Register Addresses (Address Order).................................................................................. 878
23.2 Register Bits....................................................................................................................... 889
23.3 Register States in Each Operating Mode ........................................................................... 905
Section 24 Electrical Characteristics ................................................................. 917
24.1 Absolute Maximum Ratings .............................................................................................. 917
24.2 DC Characteristics ............................................................................................................. 918
24.3 AC Characteristics ............................................................................................................. 921
24.4 USB Characteristics ........................................................................................................... 948
24.5 A/D Conversion Characteristics ........................................................................................ 950
24.6 D/A Conversion Characteristics ........................................................................................ 950
24.7 Flash Memory Characteristics ........................................................................................... 951
Appendix
A.
B.
C.
Index
Rev.1.00 Sep. 08, 2005 Page xxvi of xlviii
22.10.1 I/O Port Status....................................................................................................... 875
22.10.2 Current Consumption during Oscillation Settling Standby Period ....................... 875
22.10.3 Module Stop Mode of DMAC or DTC................................................................. 875
22.10.4 On-Chip Peripheral Module Interrupts ................................................................. 875
22.10.5 Writing to MSTPCRA, MSTPCRB, and MSTPCRC........................................... 875
24.3.1 Clock Timing ........................................................................................................ 921
24.3.2 Control Signal Timing .......................................................................................... 924
24.3.3 Bus Timing ........................................................................................................... 925
24.3.4 DMAC Timing...................................................................................................... 940
24.3.5 Timing of On-Chip Peripheral Modules ............................................................... 943
24.7.1 H8SX/1653 ........................................................................................................... 951
24.7.2 H8SX/1654 ........................................................................................................... 952
Port States in Each Pin State.............................................................................................. 953
Product Lineup................................................................................................................... 958
Package Dimensions .......................................................................................................... 959
......................................................................................................... 953
......................................................................................................... 961