DF2211NP24V Renesas Technology / Hitachi Semiconductor, DF2211NP24V Datasheet - Page 102

• Manufacturer Part Number: DF2211NP24V
• Description: H8S/2200 Series, 2212 Group, USB, RTC, HSS TNP-64B; Vcc= 2.7 to 3.6 volts, Temp= -20 to 75 C; Package: PVQN0064LB-A
• Manufacturer: Renesas Technology / Hitachi Semiconductor

Table 2.3
Notes: 1. Size refers to the operand size.
Rev.7.00 Dec. 24, 2008 Page 48 of 698
REJ09B0074-0700
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM*
STM*
2
2
2. ER7 is used as a stack pointer in STM and LDM instructions. ER7, therefore, should not
B: Byte
W: Word
L: Longword
be used as a saving (STM) or restoring (LDM) register.
Data Transfer Instructions
Size*
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn
Rn → @-SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP.
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
Rn (register list) → @-SP
Pushes two or more general registers onto the stack.