EP4SGX360FH29C3N Altera, EP4SGX360FH29C3N Datasheet - Page 221

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EP4SGX360FH29C3N

Manufacturer Part Number
EP4SGX360FH29C3N
Description
IC STRATIX IV FPGA 360K 780HBGA
Manufacturer
Altera
Series
Stratix® IV GXr

Specifications of EP4SGX360FH29C3N

Number Of Logic Elements/cells
353600
Number Of Labs/clbs
14144
Total Ram Bits
22564
Number Of I /o
289
Voltage - Supply
0.87 V ~ 0.93 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-HBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-

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© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
SIV51007-3.2
Stratix IV Device Handbook Volume 1
February 2011
February 2011
SIV51007-3.2
f
This chapter describes external memory interfaces available with the Stratix
device family and that family’s silicon capability to support external memory
interfaces. To support the level of system bandwidth achievable with Altera
Stratix IV FPGAs, the devices provide an efficient architecture to quickly and easily fit
wide external memory interfaces within their small modular I/O bank structure. The
I/Os are designed to provide high-performance support for existing and emerging
external double data rate (DDR) memory standards, such as DDR3, DDR2, DDR
SDRAM, QDR II+, QDR II SRAM, and RLDRAM II.
Stratix IV I/O elements provide easy-to-use built-in functionality required for a rapid
and robust implementation with features such as dynamic calibrated on-chip
termination (OCT), trace mismatch compensation, read- and write-leveling circuit for
DDR3 SDRAM interfaces, half data rate (HDR) blocks, and 4- to 36-bit programmable
DQ group widths.
The high-performance memory interface solution is backed-up by a self-calibrating
megafunction (ALTMEMPHY), optimized to take advantage of the Stratix IV I/O
structure and the TimeQuest Timing Analyzer, which completes the picture by
providing the total solution for the highest reliable frequency of operation across
process, voltage, and temperature (PVT) variations.
This chapter contains the following sections:
For more information about external memory system performance specifications,
board design guidelines, timing analysis, simulation, and debugging information,
refer to the
“Memory Interfaces Pin Support” on page 7–3
“Stratix IV External Memory Interface Features” on page 7–29
External Memory Interface
7. External Memory Interfaces in
Handbook.
Stratix IV Devices
®
®
IV
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