DF2345TE20 Renesas Electronics America, DF2345TE20 Datasheet - Page 222

• Manufacturer Part Number: DF2345TE20
• Description: MCU 5V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2345TE20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2345TE20; HD64F2345TE20

Section 7 Data Transfer Controller
Table 7.9
The number of execution states is calculated from the formula below. Note that
of all transfers activated by one activation event (the number in which the CHNE bit is set to 1,
plus 1).
For example, when the DTC vector address table is located in on-chip ROM, normal mode is set,
and data is transferred from the on-chip ROM to an internal I/O register, the time required for the
DTC operation is 13 states. The time from activation to the end of the data write is 10 states.
Rev. 4.00 Feb 15, 2006 page 196 of 900
REJ09B0291-0400
Bus width
Access states
Execution
status
Object to be Accessed
Number of execution states = I · S
Vector read
Register information
read/write
Byte data read
Word data read
Byte data write
Word data write
Internal operation
Number of States Required for Each Execution Status
S
S
S
S
S
S
S
I
J
K
K
L
L
M
Chip
RAM
On-
I
32
—
1
1
1
1
1
1
+
(J · S
ROM
Chip
On-
16
—
1
1
1
1
1
1
J
+ K · S
On-Chip I/O
Registers
—
—
8
2
2
4
2
4
K
+ L · S
16
—
—
2
2
2
2
2
L
1
) + M · S
—
2
4
2
4
2
4
External Devices
8
6+2m
6+2m
6+2m
M
3+m
3+m
—
3
means the sum
—
2
2
2
2
2
2
16
3+m
3+m
3+m
3+m
3+m
—
3