DF2345TE20 Renesas Electronics America, DF2345TE20 Datasheet - Page 921
DF2345TE20
Manufacturer Part Number
DF2345TE20
Description
MCU 5V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2345TE20V.pdf
(929 pages)
Specifications of DF2345TE20
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2345TE20
HD64F2345TE20
HD64F2345TE20
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2345TE20V
Manufacturer:
Renesas
Quantity:
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Part Number:
DF2345TE20V
Manufacturer:
Renesas Electronics America
Quantity:
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Timing of Transition to Hardware Standby Mode
(1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low at
(2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do
Timing of Recovery from Hardware Standby Mode
Drive the RES signal low and the NMI signal high approximately 100 ns or more before STBY
goes high to execute a power-on reset.
Appendix E Timing of Transition to and Recovery from
least 10 states before the STBY signal goes low, as shown below. RES must remain low until
STBY signal goes low (delay from STBY low to RES high: 0 ns or more).
not need to be retained, RES does not have to be driven low as in (1).
STBY
RES
STBY
RES
NMI
Figure E.2 Timing of Recovery from Hardware Standby Mode
Figure E.1 Timing of Transition to Hardware Standby Mode
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Hardware Standby Mode
t
1
10t
t
cyc
100ns
t
2
Rev. 4.00 Feb 15, 2006 page 895 of 900
0ns
t
OSC
t
NMIRH
REJ09B0291-0400
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