DF2345TE20 Renesas Electronics America, DF2345TE20 Datasheet - Page 52

• Manufacturer Part Number: DF2345TE20
• Description: MCU 5V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2345TE20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2345TE20; HD64F2345TE20

Section 2 CPU
Stack Structure: When the program counter (PC) is pushed onto the stack in a subroutine call,
and the PC, condition-code register (CCR), and extended control register (EXR) are pushed onto
the stack in exception handling, they are stored as shown in figure 2.3. When EXR is invalid, it is
not pushed onto the stack. For details, see section 4, Exception Handling.
(2) Advanced Mode
Address Space: Linear access is provided to a 16-Mbyte maximum address space (architecturally
a maximum 16-Mbyte program area and a maximum 4-Gbyte data area, with a maximum of 4
Gbytes for program and data areas combined).
Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as
the upper 16-bit segments of 32-bit registers or address registers.
Instruction Set: All instructions and addressing modes can be used.
Rev. 4.00 Feb 15, 2006 page 26 of 900
REJ09B0291-0400
SP
Notes: 1.
(a) Subroutine Branch
2.
3.
When EXR is not used it is not stored on the stack.
SP when EXR is not used.
Ignored when returning.
(16 bits)
Figure 2.3 Stack Structure in Normal Mode
PC
(SP
SP
*
2
)
(b) Exception Handling
Reserved *
(16 bits)
CCR *
EXR *
CCR
PC
1
3
1
*
3