DF2345TE20 Renesas Electronics America, DF2345TE20 Datasheet - Page 580

• Manufacturer Part Number: DF2345TE20
• Description: MCU 5V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2345TE20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2345TE20; HD64F2345TE20

Section 17 ROM
17.5.4
An effective way to assure the data retention characteristics of the programmed chips is to bake
them at 150°C, then screen them for data errors. This procedure quickly eliminates chips with
PROM memory cells prone to early failure.
Figure 17.6 shows the recommended screening procedure.
If a series of programming errors occurs while the same PROM programmer is being used, stop
programming and check the PROM programmer and socket adapter for defects.
Please inform Renesas Technology of any abnormal conditions noted during or after programming
or in screening of program data after high-temperature baking.
Rev. 4.00 Feb 15, 2006 page 554 of 900
REJ09B0291-0400
The MCU cannot be programmed in page programming mode. Select the programming mode
carefully.
The size of the H8S/2345 Group PROM is 128 kbytes. Always set addresses within the range
H'00000 to H'1FFFF. During programming, write H'FF to unused addresses to avoid
verification errors.
Reliability of Programmed Data
Figure 17.6 Recommended Screening Procedure
Bake chip for 24 to 48 hours at
125 C to 150 C with power off
Program chip and verify data
Read and check program
Mount