DF2345TE20 Renesas Electronics America, DF2345TE20 Datasheet - Page 23

• Manufacturer Part Number: DF2345TE20
• Description: MCU 5V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2345TE20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2345TE20; HD64F2345TE20

18.2 Register Descriptions ........................................................................................................ 616
18.3 Oscillator........................................................................................................................... 617
18.4 Duty Adjustment Circuit................................................................................................... 621
18.5 Medium-Speed Clock Divider .......................................................................................... 621
18.6 Bus Master Clock Selection Circuit .................................................................................. 621
Section 19 Power-Down Modes
19.1 Overview........................................................................................................................... 623
19.2 Register Descriptions ........................................................................................................ 625
19.3 Medium-Speed Mode........................................................................................................ 628
19.4 Sleep Mode ....................................................................................................................... 629
19.5 Module Stop Mode ........................................................................................................... 630
19.6 Software Standby Mode.................................................................................................... 632
19.7 Hardware Standby Mode .................................................................................................. 635
19.8
Section 20 Electrical Characteristics
20.1 Electrical Characteristics of F-ZTAT Version .................................................................. 637
20.2 Electrical Characteristics of ZTAT, Mask ROM, and ROMless Versions........................ 650
18.2.1 System Clock Control Register (SCKCR) ........................................................... 616
18.3.1 Connecting a Crystal Resonator........................................................................... 617
18.3.2 External Clock Input ............................................................................................ 619
19.1.1 Register Configuration......................................................................................... 624
19.2.1 Standby Control Register (SBYCR) .................................................................... 625
19.2.2 System Clock Control Register (SCKCR) ........................................................... 627
19.2.3 Module Stop Control Register (MSTPCR) .......................................................... 628
19.5.1 Module Stop Mode .............................................................................................. 630
19.5.2 Usage Notes ......................................................................................................... 631
19.6.1 Software Standby Mode....................................................................................... 632
19.6.2 Clearing Software Standby Mode ........................................................................ 632
19.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode... 633
19.6.4 Software Standby Mode Application Example.................................................... 634
19.6.5 Usage Notes ......................................................................................................... 634
19.7.1 Hardware Standby Mode ..................................................................................... 635
19.7.2 Hardware Standby Mode Timing......................................................................... 635
20.1.1 Absolute Maximum Ratings ................................................................................ 637
20.1.2 DC Characteristics ............................................................................................... 638
20.1.3 AC Characteristics ............................................................................................... 641
20.1.4 A/D Conversion Characteristics........................................................................... 646
20.1.5 D/A Conversion Characteristics........................................................................... 647
20.1.6 Flash Memory Characteristics ............................................................................. 648
Clock Output Disabling Function .................................................................................. 636
...................................................................................... 623
.............................................................................. 637
Rev. 4.00 Feb 15, 2006 page xxi of xxiv