DF2345TE20 Renesas Electronics America, DF2345TE20 Datasheet - Page 54

• Manufacturer Part Number: DF2345TE20
• Description: MCU 5V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2345TE20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2345TE20; HD64F2345TE20

Section 2 CPU
Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a
subroutine call, and the PC, condition-code register (CCR), and extended control register (EXR)
are pushed onto the stack in exception handling, they are stored as shown in figure 2.5. When
EXR is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling.
Rev. 4.00 Feb 15, 2006 page 28 of 900
REJ09B0291-0400
SP
Notes: 1.
(a) Subroutine Branch
2.
3.
When EXR is not used it is not stored on the stack.
SP when EXR is not used.
Ignored when returning.
Reserved
(24 bits)
Figure 2.5 Stack Structure in Advanced Mode
PC
(SP
SP
*
2
)
(b) Exception Handling
Reserved *
(24 bits)
EXR *
CCR
PC
1
1
*
3