MPC555CME Freescale Semiconductor, MPC555CME Datasheet - Page 60

• Manufacturer Part Number: MPC555CME
• Description: KIT EVALUATION FOR MPC555
• Manufacturer: Freescale Semiconductor
• Type: Microcontrollerr

Specifications of MPC555CME

• Contents: Module Board, Installation Guide, Power Supply, Cable, Software and more
• Processor To Be Evaluated: MPC555
• Data Bus Width: 32 bit
• Interface Type: RS-232
• For Use With/related Products: MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

4X
MPC555
USER’S MANUAL
(E1)
4X
19X
INDEX
PIN 1
0.2
e
/2
e
/
B
E
MPC556
Figure 2-1 MPC555 / MPC556 Case Dimensions and Packaging
1 2 3
4
5
6 7 8 9 10 11 12 13 14 15 16 17 18 19
BOTTOM VIEW
TOP VIEW
(D1)
D2
D
19X
e
SIGNAL DESCRIPTIONS
Rev. 15 October 2000
CASE 1135A–01
20
ISSUE B
W
M
G
Y
V
U
T
R
P
N
L
K
J
H
F
E
D
C
B
A
E2
0.2
C
272X
M
0.15
0.3
A
b 3
M
M
A3
B
0.35 A
0.2 A
A
A
C
272X
SIDE VIEW
B
C
A
A2
NOTES:
A1
1. DIMENSIONS AND TOLERANCING PER ASME
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION IS MEASURED AT THE MAXIMUM
4. PRIMARY DATUM A AND THE SEATING PLANE
A
Y14.5M, 1994.
SOLDER BALL DIAMETER PARALLEL TO
PRIMARY DATUM A.
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
b
E
e
23.30
23.30
MILLIMETERS
MIN
2.05
0.50
0.50
1.05
0.60
27.00 BSC
24.13 REF
27.00 BSC
24.13 REF
1.27 BSC
24.70
24.70
MAX
2.65
0.70
0.70
1.25
0.90
MOTOROLA
2-2