MPC555CME Freescale Semiconductor, MPC555CME Datasheet - Page 883

• Manufacturer Part Number: MPC555CME
• Description: KIT EVALUATION FOR MPC555
• Manufacturer: Freescale Semiconductor
• Type: Microcontrollerr

Specifications of MPC555CME

• Contents: Module Board, Installation Guide, Power Supply, Cable, Software and more
• Processor To Be Evaluated: MPC555
• Data Bus Width: 32 bit
• Interface Type: RS-232
• For Use With/related Products: MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

G.5.1 Thermal References:
MPC555 / MPC556
USER’S MANUAL
where:
If the board temperature is known and the heat loss from the package case to the air
can be ignored, acceptable predictions of junction temperature can be made. For this
method to work, the board and board mounting must be similar to the test board used
to determine the junction to board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and vias attaching the thermal balls to the ground plane.
When the board temperature is not known, a thermal simulation of the application is
needed. The simple two resistor model can be used with the thermal simulation of the
application [2], or a more accurate and complex model of the package can be used in
the thermal simulation. Consultation on the creation of the complex model is available.
To determine the junction temperature of the device in the application after prototypes
are available, the thermal characterization parameter (Ψ
the junction temperature with a measurement of the temperature at the top center of
the package case using the following equation:
where:
The thermal characterization parameter is measured per JESD51-2 characteristic
published by JEDEC using a 40 gauge type T thermocouple epoxied to the top center
of the package case. The thermocouple should be positioned so that the thermocouple
junction rests on the package. A small amount of epoxy is placed over the thermocou-
ple junction and over about 1 mm of wire extending from the junction. The thermocou-
ple wire is placed flat against the package case to avoid measurement errors caused
by cooling effects of the thermocouple wire.
Semiconductor Equipment and Materials International
805 East Middlefield Rd
Mountain View, CA 94043
[phone]
T
R
P
T
R
P
B
T
D
D
θJB
θJA
= thermocouple temperature on top of package (°C)
= board temperature (°C)
= power dissipation in package (W)
= power dissipation in package
= package junction to board resistance (°C/W)
= thermal characterization parameter
ELECTRICAL CHARACTERISTICS
Rev. 15 October 2000
T
T
J
J
= T
= T
B
T
+ (R
+ (Ψ
θJB
JA
x P
x P
D
D
)
)
JT
) can be used to determine
MOTOROLA
G-5