UPD78F1009GB-GAH-AX Renesas Electronics America, UPD78F1009GB-GAH-AX Datasheet - Page 1141

• Manufacturer Part Number: UPD78F1009GB-GAH-AX
• Description: MCU 16BIT 78K0R/KX3-L 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0R/Kx3-Lr

Specifications of UPD78F1009GB-GAH-AX

• Core Processor: 78K/0R
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 50
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 3K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

<R>
<R>
<R>
78K0R/Kx3-L
representative.
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
R01UH0106EJ0300 Rev.3.00
Oct 01, 2010
Infrared reflow
Wave soldering
Partial heating
Soldering Method
Cautions 1.
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an Renesas Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.renesas.com/prod/package/index.html) (under production)
• 44-pin plastic LQFP (10 × 10)
• 52-pin plastic LQFP (10 × 10)
• 64-pin plastic LQFP (12 × 12)
•80-pin plastic LQFP (14 × 14)
•100-pin plastic LQFP (14 × 20)
μ
μ
μ
μ
μ
μ
PD78F1000GB-GAF-AX,
PD78F1004GB-GAG-AX,
PD78F1007GK-GAJ-AX,
PD78F1010GC-GAD-AX,
PD78F1027GC-GAD-AX,
PD78F1013GF-GAS-AX,
2.
Recommended soldering conditions about WQFN package of the 78K0R/KC3-L and 78K0R/KE3-L
are under development.
For soldering methods and conditions other than those recommended below, contact an
Renesas Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 7 days
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
Table 33-1. Surface Mounting Type Soldering Conditions (1/2)
μ
Note
μ
μ
μ
μ
μ
PD78F1008GK-GAJ-AX,
PD78F1001GB-GAF-AX,
PD78F1014GF-GAS-AX,
PD78F1005GB-GAG-AX,
PD78F1011GC-GAD-AX,
PD78F1028GC-GAD-AX
(after that, prebake at 125°C for 10 to 72 hours)
Soldering Conditions
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
μ
μ
μ
μ
μ
PD78F1009GK-GAJ-AXX
Note
PD78F1002GB-GAF-AX,
PD78F1029GF-GAS-AX,
PD78F1006GB-GAG-AX
PD78F1012GC-GAD-AX,
(after that, prebake at 125°C for
μ
μ
PD78F1003GB-GAF-AX
PD78F1030GF-GAS-AX
IR60-107-3
WS60-107-1
Condition Symbol
Recommended
−
1141