UPD78F1009GB-GAH-AX Renesas Electronics America, UPD78F1009GB-GAH-AX Datasheet - Page 1155

• Manufacturer Part Number: UPD78F1009GB-GAH-AX
• Description: MCU 16BIT 78K0R/KX3-L 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0R/Kx3-Lr

Specifications of UPD78F1009GB-GAH-AX

• Core Processor: 78K/0R
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 50
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 3K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

78K0R/Kx3-L
B.1 Major Revisions in This Edition
Remark “Classification” in the above table classifies revisions as follows.
R01UH0106EJ0300 Rev.3.00
Oct 01, 2010
Throughout
CHAPTER 1 OUTLINE
p.22
p.22
CHAPTER 3 PIN FUNCTIONS (78K0R/KF3-L, 78K0R/KG3-L)
pp.116, 117,
119, 120
CHAPTER 6 PORT FUNCTIONS (78K0R/KF3-L, 78K0R/KG3-L)
p.288
CHAPTER 14 SERIAL ARRAY UNIT
pp.743 to
755
CHAPTER 26 FLASH MEMORY
p. 989
CHAPTER 31 ELECTRICAL SPECIFICATIONS (78K0R/KF3-L, 78K0R/KG3-L)
p.1082
p.1091
p.1093
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
pp.1141,
1142
p.1142
APPENDIX A DEVELOPMENT TOOLS
p.1149
p.1152
Page
−
−
−
−
(a): Error correction, (b): Addition/change of specifications, (c): Addition/change of description or note,
(d): Addition/change of package, part number, or management division, (e): Addition/change of related
documents
Change of status of 40-pin plastic WQFN, 48-pin plastic WQFN, and 64-pin plastic WQFN from
mass production to under development
Change of status of 64-pin plastic WQFN from mass production to development cancelation
Change of status of 100-pin plastic FBGA from under development to mass production
Change of EV
Change URL of Renesas Electronics website
Addition of Note 1 to ROM, RAM capacities
Change 196 KB of ROM, RAM capacities to 192 KB
Change recommended connection of unused pins of P13 and P43
Addition of Caution to 6.2.7 Port 5 (
Addition of 14.9 Relationship Between Register Settings and Pins
Addition of 26.8 Processing Time of Each Command When Using PG-FP5 (Reference
Values)
Deletion of description of EPSON TOYOCOM CORPORATION in (5) XT1 oscillation: Crystal
resonator of 31.3.4 Recommended oscillator circuit constants
Deletion of 31.4.2 Supply current characteristics (
78F1014)
Change the value of I
Addition of recommended soldering conditions of
Addition of 100-pin plastic FBGA to Table 33-1. Surface Mounting Type Soldering Conditions
Change of status in flash memory programming adapter of 78K0R/KG3-L from under development
to mass production
Change of status in exchange adapter and target connector of 78K0R/KG3-L from under
development to mass production
DD
and EV
DD2
SS
of supply current
of 78K0R/KF3-L to EV
APPENDIX B REVISION HISTORY
μ
PD78F1027, 78F1028, 78F1029, 78F1030)
Description
DD0
μ
PD78F1027, 78F1028, 78F1029, 78F1030
and EV
μ
PD78F1010, 78F1011, 78F1012, 78F1013,
SS0
APPENDIX B REVISION HISTORY
Classification
(d)
(d)
(b)
(c)
(a)
(a)
(c)
(c)
(c)
(b)
(b)
(b)
(b)
(b)
(b)
(b)
−
1155