DS3163 Maxim Integrated Products, DS3163 Datasheet - Page 125

• Manufacturer Part Number: DS3163
• Description: IC TRPL ATM/PACKET PHY 400-PBGA
• Manufacturer: Maxim Integrated Products

Specifications of DS3163

• Applications: *
• Mounting Type: Surface Mount
• Package / Case: 400-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 10-13. DS3 M23 (with C-bits used as payload) Frame
10.5.11.3 E3 G.751 Direct and PLCP Mapping
For direct mapping into E3 G.751 frames, ATM cells and HDLC packets are bit aligned. ATM cells can also be
PLCP mapped to the E3 G.751 frame. When E3 PLCP mapping is used, the first four bits of the payload (E3 frame
bits 13,14,15 and 16) are forced to be 1100 and the rest of the payload is used for the PLCP frame which is
transmitted byte aligned and the NAD bit is ignored.
Figure 10-14. E3 G.751 Frame
In E3 PLCP framing, the ATM cell is always cell aligned into the PLCP frame, HDLC packets can not be mapped
into PLCP frames. The E3 PLCP frame can only be mapped into a E3 G.751 frame. The NAD control bit is ignored.
M
M
M
X
X
P
P
1
2
1
2
1
2
3
FAS
bits
84
F
F
F
F
F
F
F
A N
11
21
31
41
51
61
71
169
bits
F
F
F
F
F
F
F
384 Payload Bits
376 Payload Bits
384 Payload Bits
384 Payload Bits
12
22
32
42
52
62
72
384 bits
680 Bits
bits
169
F
F
F
F
F
F
F
13
23
33
43
53
63
73
169
bits
F
F
F
F
F
F
F
14
24
34
44
54
64
74
bits
84
4 Rows
7 Sub-
Frames