MPC561MZP56 Freescale, MPC561MZP56 Datasheet - Page 37

• Manufacturer Part Number: MPC561MZP56
• Manufacturer: Freescale

Specifications of MPC561MZP56

• Cpu Family: MPC56x
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 56MHz
• Interface Type: QSPI/SCI/SPI/UART
• Total Internal Ram Size: 32KB
• # I/os (max): 56
• Number Of Timers - General Purpose: 22
• Operating Supply Voltage (typ): 2.6/5V
• Operating Supply Voltage (max): 2.7/5.25V
• Operating Supply Voltage (min): 2.5/4.75V
• On-chip Adc: 2(32-chx10-bit)
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 388
• Package Type: BGA
• Program Memory Type: ROMLess
• Program Memory Size: Not Required
• Lead Free Status / RoHS Status: Not Compliant

D.20.1.1
D.20.1.2
D.20.1.3
D.20.1.4
D.20.1.5
D.20.1.6
D.20.2
D.20.3
D.20.3.1
D.20.3.2
D.20.3.3
F.1
F.2
F.2.1
F.2.2
F.2.3
F.3
F.3.1
F.4
F.5
F.6
F.7
F.8
F.8.1
F.8.2
F.9
F.9.1
F.9.2
F.10
F.10.1
F.11
F.12
F.13
Freescale Semiconductor
Paragraph
Number
Package ............................................................................................................................ F-2
EMI Characteristics ......................................................................................................... F-2
Thermal Characteristics ................................................................................................... F-3
ESD Protection ................................................................................................................ F-6
DC Electrical Characteristics........................................................................................... F-7
Oscillator and PLL Electrical Characteristics................................................................ F-11
Flash Electrical Characteristics...................................................................................... F-12
Power-Up/Down Sequencing......................................................................................... F-13
Issues Regarding Power Sequence ................................................................................ F-17
AC Timing ..................................................................................................................... F-18
READI Electrical Characteristics .................................................................................. F-45
RESET Timing............................................................................................................... F-47
IEEE 1149.1 Electrical Characteristics.......................................................................... F-50
Host RCPU Initialization of the SIOP Function....................................................... D-57
SIOP Function Performance ..................................................................................... D-57
Reference Documents .................................................................................................. F-2
Definitions and Acronyms ........................................................................................... F-3
EMI Testing Specifications.......................................................................................... F-3
Thermal References ..................................................................................................... F-5
Power-Up/Down Option A ........................................................................................ F-13
Power-Up/Down Option B ........................................................................................ F-15
Application of PORESET or HRESET ..................................................................... F-17
Keep-Alive RAM....................................................................................................... F-18
Debug Port Timing .................................................................................................... F-43
CHAN_CONTROL .............................................................................................. D-56
BIT_D ................................................................................................................... D-56
HALF_PERIOD ................................................................................................... D-56
BIT_COUNT ........................................................................................................ D-56
XFER_SIZE.......................................................................................................... D-56
SIOP_DATA ......................................................................................................... D-57
XFER_SIZE Greater Than 16 .............................................................................. D-58
Data Positioning.................................................................................................... D-58
Data Timing .......................................................................................................... D-58
MPC561/MPC563 Reference Manual, Rev. 1.2
Electrical Characteristics
Memory Access Timing
Contents
Appendix E
Appendix F
Title
Number
Page
xxxvii