EP4SGX530HH35C2N Altera, EP4SGX530HH35C2N Datasheet - Page 197

• Manufacturer Part Number: EP4SGX530HH35C2N
• Description: IC STRATIX IV FPGA 530K 1152HBGA
• Manufacturer: Altera
• Series: Stratix® IV GXr

Specifications of EP4SGX530HH35C2N

• Number Of Logic Elements/cells: 531200
• Number Of Labs/clbs: 21248
• Total Ram Bits: 27376
• Number Of I /o: 564
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 1152-HBGA
• Family Name: Stratix® IV
• Number Of Logic Blocks/elements: 531200
• # Registers: 424960
• # I/os (max): 560
• Process Technology: 40nm
• Operating Supply Voltage (typ): 900mV
• Logic Cells: 531200
• Ram Bits: 28033024
• Operating Supply Voltage (min): 0.87V
• Operating Supply Voltage (max): 0.93V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 1152
• Package Type: FCHBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Compliant

Chapter 6: I/O Features in Stratix IV Devices
On-Chip Termination Support and I/O Termination Schemes
February 2011 Altera Corporation
A pair of RUP and RDN pins are available in a given I/O bank and are shared for
series- and parallel-calibrated termination. The RUP and RDN pins share the same V
and GND, respectively, with the I/O bank where they are located. The RUP and RDN
pins are dual-purpose I/Os and function as regular I/Os if you do not use the
calibration circuit.
For calibration, the connections are as follows:
■
■
For on-chip parallel termination, the connections are as follows:
■
■
On-Chip Series (R
Stratix IV devices support driver-impedance matching to provide the I/O driver with
controlled output impedance that closely matches the impedance of the transmission
line. As a result, you can significantly reduce reflections. Stratix IV devices support
on-chip series termination for single-ended I/O standards
The R
Typical R
strength is no longer selectable.
Figure 6–18. On-Chip Series Termination Without Calibration
To use on-chip termination for the SSTL Class I standard, you must select the 50- Ω
on-chip series termination setting, thus eliminating the external 25- Ω R
the 50- Ω transmission line). For the SSTL Class II standard, you must select the 25- Ω
on-chip series termination setting (to match the 50- Ω transmission line and the
near-end external 50- Ω pull-up to V
The RUP pin is connected to V
resistor for an on-chip series termination value of 25- Ω or 50- Ω , respectively.
The RDN pin is connected to GND through an external 25- Ω ±1% or 50- Ω ±1%
resistor for an on-chip series termination value of 25- Ω or 50- Ω , respectively.
The RUP pin is connected to V
The RDN pin is connected to GND through an external 50- Ω ±1% resistor.
S
shown in
S
values are 25 Ω and 50 Ω . When you select matching impedance, current
Series Termination
Figure 6–18
Stratix IV Driver
S
) Termination Without Calibration
V
GND
CCIO
is the intrinsic impedance of the output transistors.
R
R
S
S
CCIO
CCIO
TT
).
through an external 25- Ω ±1% or 50- Ω ±1%
through an external 50- Ω ±1% resistor.
Z
O
= 50 Ω
(Figure
Stratix IV Device Handbook Volume 1
Receiving
Device
6–18).
S
(to match
CCIO
6–25