MC68EN360CAI25L Freescale Semiconductor, MC68EN360CAI25L Datasheet - Page 814

• Manufacturer Part Number: MC68EN360CAI25L
• Description: IC MPU QUICC 25MHZ 240-FQFP
• Manufacturer: Freescale Semiconductor
• Series: MC68000r

Specifications of MC68EN360CAI25L

• Processor Type: M683xx 32-Bit
• Speed: 25MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 240-FQFP
• Core Size: 32 Bit
• Cpu Speed: 25MHz
• Embedded Interface Type: SCP, TDM
• Digital Ic Case Style: FQFP
• No. Of Pins: 240
• Supply Voltage Range: 4.75V To 5.25V
• Rohs Compliant: Yes
• Family Name: M68xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 25MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 5V
• Operating Supply Voltage (max): 5.25V
• Operating Supply Voltage (min): 4.75V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 240
• Package Type: FQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

Electrical Characteristics
10.2 THERMAL CHARACTERISTICS
10.3 POWER CONSIDERATIONS
The average chip-junction temperature, T J , in C can be obtained from:
For most applications, P I/O < 0.3*P INT and can be neglected.
An approximate relationship between P D and T J (if P I/O is neglected) is:
10-2
where:
T A =
P D =
PINT =
P I/O =
JA =
T J = T A + (P D • JA )
P D = K
Solving Equations (1) and (2) for K gives:
K = P D • (T A + 273 C) + JA • P D
Ambient Temperature, C
Package Thermal Resistance, Junction-to-Ambient, C/W
P INT + P I/O
I CC x V CC , Watts—Chip Internal Power
Power Dissipation on Input and Output Pins—User Determined
(T J + 273 C)
Thermal Resistance—Junction to Case
Thermal Resistance—Junction to Ambient
Thermal Resistance—Junction to Ambient
Notes:
1. Assumes natural convection and a single layer board (no thermal vias).
2. Assumes natural convection, a multi layer board with thermal vias
3. Assumes natural convection, a multi layer board with thermal vias
4. For more information on the design of thermal vias on multilayer boards and
68360 dissipation, and a board temperature rise of 30 C above ambient.
68360 dissipation, and a board temperature rise of 15 C above ambient.
BGA layout considerations in general, refer to AN-1231/D, “Plastic Ball Grid
Array Application Note” available from your local Motorola sales office.
T
J
= T
P
where:
240-Pin QFP
241-Pin PGA
357-Pin BGA
240-Pin QFP
241-Pin PGA
357-pin BGA
D
P
A
= (V
I/O
+ (P
Freescale Semiconductor, Inc.
is the power dissipation on pins.
DD
For More Information On This Product,
D
Characteristic
•
•
I
JA
DD
MC68360 USER’S MANUAL
)
) + P
Go to: www.freescale.com
I/O
2
Symbol
JC
JA
JA
Value
27.4
22.8
47
30
20
2
7
8
1
2
3
4
4
, 1.5 watt
,1.5 watt
Unit
C/W
C/W
C/W
(1)
(2)
(3)