MC68EN360CAI25L Freescale Semiconductor, MC68EN360CAI25L Datasheet - Page 916

IC MPU QUICC 25MHZ 240-FQFP

MC68EN360CAI25L

Manufacturer Part Number
MC68EN360CAI25L
Description
IC MPU QUICC 25MHZ 240-FQFP
Manufacturer
Freescale Semiconductor
Series
MC68000r

Specifications of MC68EN360CAI25L

Processor Type
M683xx 32-Bit
Speed
25MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
240-FQFP
Core Size
32 Bit
Cpu Speed
25MHz
Embedded Interface Type
SCP, TDM
Digital Ic Case Style
FQFP
No. Of Pins
240
Supply Voltage Range
4.75V To 5.25V
Rohs Compliant
Yes
Family Name
M68xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
25MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
5V
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
4.75V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
240
Package Type
FQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68EN360CAI25L
Manufacturer:
APLHA
Quantity:
12 000
Part Number:
MC68EN360CAI25L
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68EN360CAI25L
Manufacturer:
FREESCALE
Quantity:
20 000
Development Tools and Support
The X.25 module features are as follows:
The EDX module features are as follows:
B-4
• Supports external loopback between two QUICC serial channels or on the same serial
• Trace option for reporting to system management each primitive issued by the LAPB
• Fully implements 1988 CCITT Recommendation X.25, chapters 3.1–7.3
• May be used with both layer 2 modules: LAPD or LAPB
• Unlimited number of layer 2 interfaces
• Supports up to 4095 logical channels for each interface
• Many DTE/DCE interface parameters (configurable for each interface):
• Layer 4 message fragmentation/assembly using M-BIT
• Q-BIT support
• All standard CCITT X.25 facilities
• Compatible with X.213 interface primitives
• Logical channel parameters (configurable for each interface):
• Message-oriented interface
• Independent of layer 2 and layer 4 implementation
• The EDX event-driven executive is an operating system kernel that provides:
• EDX was designed to be:
channel
module to layer 3 or layer 2 management
—DTE/DCE
—Modulo 8 or 128 operation
—Window size
—Maximum receive and transmit packet lengths
—Interface ID
—DTE/DCE
—Permanent virtual circuit/virtual call
—D-BIT support
—On-line registration support
—TOA/NPI address mode
—Fast select facility support
—Logical channel (and group) numbers
—Protocol parameters (w, T11, T12, T21, T22, N12, N13)
—Maximum data packet length (unlimited)
—Multitasking with simple task scheduling
—Message passing between tasks
—Memory allocation
—Fast (written mostly in M68000-family assembler)
—Efficient (uses approximately 1.5 Kbytes of ROM)
Freescale Semiconductor, Inc.
For More Information On This Product,
MC68360 USER’S MANUAL
Go to: www.freescale.com

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