MCF5270CAB100 Freescale Semiconductor, MCF5270CAB100 Datasheet - Page 180

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MCF5270CAB100

Manufacturer Part Number
MCF5270CAB100
Description
MCU V2 COLDFIRE 64K SRAM 160-QFP
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5270CAB100

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
100MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
39
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-QFP
Processor Series
MCF527x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5270CAB100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Chip Configuration Module (CCM)
9.3.3
The following subsection describes the CCM registers.
9.3.3.1
9-4
Address
1
2
3
4
Reset
S = CPU supervisor mode access only. User mode accesses to supervisor only addresses have no effect and result in
a cycle termination transfer error.
See
writes to this register.
Writing to reserved addresses with values other than 0 could put the device in a test mode; reading returns 0s.
Accessing an unimplemented address has no effect and causes a cycle termination transfer error.
14–7
Bits
W
15
R LOAD
6
Chapter 8, “Power Management,”
Note: The reset value of the LOAD field is determined during reset configuration. The SZEN is set and the BME
bit is set to enable the bus monitor and all other bits in the register are cleared at reset.
Register Descriptions
15
Chip Configuration Register (CCR)
To safeguard against unintentionally activating test logic, write
0x0000 to the above reserved location during initialization
(immediately after reset) to lock out test features. Setting any bits in
the CCR may lead to unpredictable results.
Name
LOAD
SZEN
14
0
13
0
Figure 9-2. Chip Configuration Register (CCR)
Pad driver load. The LOAD bit selects full or partial drive strength for selected pad output
0 Default drive strength.
1 Full drive strength.
Table 9-2
Reserved, should be cleared.
TSIZ[1:0] enable. This read/write bit enables the TSIZ[1:0] function of the external pins.
0 TSIZ[1:0] function disabled. DMA Acknowlede function enabled on the TSIZ[1:0] pins.
1 TSIZ[1:0] function enabled. DMA Acknowlede function disabled on the TSIZ[1:0] pins.
drivers. For maximum capacitive load, set the LOAD bit to select full drive strength. For
reduced power consumption and reduced electromagnetic interference (EMI), clear the
LOAD bit to select partial drive strength.
12
0
Table 9-4. CCR Field Descriptions
11
shows the read/write accessibility of this write-once bit.
0
MCF5271 Reference Manual, Rev. 2
for a description of the LPCR. It is shown here only to warn against accidental
10
0
9
0
IPSBAR + 0x11_0004
NOTE
0
8
See Note
0
7
Description
SZEN PSTEN
6
5
0
4
BME
3
Freescale Semiconductor
2
BMT
1
0

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